The Development and Challenges of 3D IC

• Main Authors: Mu-Ming Lee, 李牧民
• Other Authors: Shyong Lee
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/09051195681734909599

碩士 === 國立中央大學 === 機械工程學系 === 104 === This thesis presents a survey of 3D integration, including 3D IC packing, 3D IC integration and also a survey of 3D Integrated Circuits using Through Silicon Vias (TSV). 3D integration, packing, 3D IC Integrated Circuits and also TSV will be defined, the evolution of 2D IC’s to 3D IC’s and the rationale for moving to these systems will be given, and a whole overview of the construction and process of the 3D Integrated Circuit and TSV will be presented. This thesis also will give a detail caption about the interposer, which is the heart of 3D IC, and also the manufacturing process of the interposer. Lastly, the testing mechanism, application and challenges of 3D Integrated Circuits using TSVs will be discussed.