Integration of 3D printed wavy substrate with topologically tailored electrospun piezoelectric fibers array for self-powered pressure and deformation sensors applications

碩士 === 國立中央大學 === 能源工程研究所 === 104 === Near-field electrospinning (NFES) is a newly-established technique by electrically charged a polymer solution to produce the site addressable one-dimensional (1D) fibers or two-dimensional (2D) aligned fibrous meshes. Nevertheless, the direct electrospinning of...

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Bibliographic Details
Main Authors: Bo-Sheng Wang, 王博生
Other Authors: Yiin-Kuen Fuh
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/42ad2c
Description
Summary:碩士 === 國立中央大學 === 能源工程研究所 === 104 === Near-field electrospinning (NFES) is a newly-established technique by electrically charged a polymer solution to produce the site addressable one-dimensional (1D) fibers or two-dimensional (2D) aligned fibrous meshes. Nevertheless, the direct electrospinning of fibers into controllable is still a nascent technology. In this thesis, a new integration of paper-based self-powered sensors (PBSSs) and three-dimensional (3D) architectures of NFES electrospun polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) is demonstrated in a direct-write and in-situ poled manner. Owing to the principle of piezoelectricity, the uni-poled dipole moment will be accumulated across the electrospun fibers and the output voltage and current could reach to 4V and 100 nA respectively. Furthermore, the additive manufacture of 3D printed technique is applied to fabricate the sinusoidal wavy substrate and NFES electrospun fibers in the 3D topology. This 3D architecture is capable of greatly enhancing the piezoelectric output. Finally, the proposed piezoelectrically integrated 3D architecture is applied to the self-powered sensors such as foot pressure measurement, human motion monitoring and finger-induced power generation. The proposed technique has the potential to advance the existing electrospinning technologies in constructing 3D structures for biomedical and wearable electronics.