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碩士 === 國立中央大學 === 化學工程與材料工程學系 === 104 === In electronic packaging, plating a diffusion barrier is commonly way to prevent the formation of undesirable intermetallic compounds (IMCs), and Nickel have known as an effective diffusion barrier to block the diffusion of Sn atoms. In this study, electrol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/n8zd4d |