Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier

碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 104 === The production methods of flexible electronic can be divided into two categories,roll to roll (R2R) and sheet to sheet (S2S). In the S2S Industry, fabricating the flexible electronic needed to be applied by temporary bonding technology. In the process o...

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Main Authors: Lee, Chih-Tsung, 李志宗
Other Authors: Leu, Jih-Perng
Format: Others
Language:en_US
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/99156165817318259744
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spelling ndltd-TW-104NCTU58310122017-09-06T04:22:27Z http://ndltd.ncl.edu.tw/handle/99156165817318259744 Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier 暫時性接著技術中聚亞醯胺基板與玻璃載板間離形能力之探討 Lee, Chih-Tsung 李志宗 碩士 國立交通大學 平面顯示技術碩士學位學程 104 The production methods of flexible electronic can be divided into two categories,roll to roll (R2R) and sheet to sheet (S2S). In the S2S Industry, fabricating the flexible electronic needed to be applied by temporary bonding technology. In the process of fabricating the flexible electronic, flexible substrate was attached onto the rigid carrier. Finally, the flexible substrate separated from the rigid carrier. In recent decades, the temporary bonding technology continue to be developed and research. Wherein polyimide substrate and glass carrier were the most popular in high temperature Fabrication, mainly due to polyimide is the most temperature resistant engineering plastic and the glass is the most common rigid carrier. Separating polyimide substrate and glass carrier were including laser separation method, glue sticking reducing method, and the mechanical force releasing method. The mechanical force releasing method was among the lowest cost, the highest capacity, and the least polluting method. This method could be divide into "deposited de-bonding layer" and "directly coating". No intermediate layer, “directly coating”, of mechanical force releasing method was the lowest-cost way. However, the absence of an intermediate layer, the releasing ability and releasing stability of the technology is the biggest problem, but also led the technology so far had not been widely used. The aims of this paper were researching the issues of polyimide substrate and glass carrier by different synthesis methods polyimide and different types of glass; In addition, polyimide in direct contact with the glass surface, so we also focus on the effect of glass surface treatment. The study found that when the glass weathered layer had been removed or usage of unweathered glass, it would lead to the original easily releasing of polyimide into difficult releasing. Weathered layer corresponds to the natural separated layer. The weathered glass enhanced the yield and to maintain a good releasing stability. Leu, Jih-Perng 呂志鵬 2016 學位論文 ; thesis 88 en_US
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language en_US
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description 碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 104 === The production methods of flexible electronic can be divided into two categories,roll to roll (R2R) and sheet to sheet (S2S). In the S2S Industry, fabricating the flexible electronic needed to be applied by temporary bonding technology. In the process of fabricating the flexible electronic, flexible substrate was attached onto the rigid carrier. Finally, the flexible substrate separated from the rigid carrier. In recent decades, the temporary bonding technology continue to be developed and research. Wherein polyimide substrate and glass carrier were the most popular in high temperature Fabrication, mainly due to polyimide is the most temperature resistant engineering plastic and the glass is the most common rigid carrier. Separating polyimide substrate and glass carrier were including laser separation method, glue sticking reducing method, and the mechanical force releasing method. The mechanical force releasing method was among the lowest cost, the highest capacity, and the least polluting method. This method could be divide into "deposited de-bonding layer" and "directly coating". No intermediate layer, “directly coating”, of mechanical force releasing method was the lowest-cost way. However, the absence of an intermediate layer, the releasing ability and releasing stability of the technology is the biggest problem, but also led the technology so far had not been widely used. The aims of this paper were researching the issues of polyimide substrate and glass carrier by different synthesis methods polyimide and different types of glass; In addition, polyimide in direct contact with the glass surface, so we also focus on the effect of glass surface treatment. The study found that when the glass weathered layer had been removed or usage of unweathered glass, it would lead to the original easily releasing of polyimide into difficult releasing. Weathered layer corresponds to the natural separated layer. The weathered glass enhanced the yield and to maintain a good releasing stability.
author2 Leu, Jih-Perng
author_facet Leu, Jih-Perng
Lee, Chih-Tsung
李志宗
author Lee, Chih-Tsung
李志宗
spellingShingle Lee, Chih-Tsung
李志宗
Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
author_sort Lee, Chih-Tsung
title Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
title_short Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
title_full Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
title_fullStr Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
title_full_unstemmed Temporary Bonding Technology: Investigation on The Interfacial Releasing Ability between Polyimide Substrate and Glass Carrier
title_sort temporary bonding technology: investigation on the interfacial releasing ability between polyimide substrate and glass carrier
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/99156165817318259744
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