The Study of Yield Improvement in 30 nm DRAM Storage Node Contact PAD

碩士 === 國立交通大學 === 理學院應用科技學程 === 104 === The process of manufacturing an integrated circuit (IC), including IC design, wafer fabrication, packaging and final testing, is an extremely precise and complicated process. The wafer fabrication processes consist of the processes from the wafer input, semi...

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Bibliographic Details
Main Authors: Shih, Chao-Fu, 施朝富
Other Authors: Wu, Kaung-Hsiung
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/20114691264751299277