Exploration of failure mechanisms in Sn-Ag-Cu solder joints under thermal cycling test by modulation of Ag content in solder and the selection of surface finish
碩士 === 國立交通大學 === 材料科學與工程學系所 === 104 === When the electronic devices are in operation, the Wafer Level Chip Scale Packaging (WLCSP) interconnects are subjected to thermo-mechanical fatigue that is generated by temperature cycles reacting with a substrate and a chip that have different coefficients o...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87791849768976262621 |