Low Thermal Budget Amorphous Silicon for Fabrication of Photovoltaic and Non-volatile Memory Devices

博士 === 國立交通大學 === 材料科學與工程學系所 === 104 === The demand for system on panel (SoP) and monolithic 3D integration is increasing for realizing devices with high density and operation speed and low power consumption to fabricate future chip integration. However, the conventional high thermal processes const...

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Bibliographic Details
Main Authors: Huang, Wen-Hsien, 黃文賢
Other Authors: Pan, Fu-Ming
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/61524689266630700346