| Summary: | 碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 104 === The electronic products are widely used, electronic equipment also turn toward higher integration, bigger power , and request strictly to develop, at present, therefore the industry of the IC testing attaches great importance to environmental temperature for IC testing.
The purpose of this research make to investigate relation between junction temperature reading of the IC by testing program and equipment parameters setting of the active thermal control system.
To conduct setting parameters of the system in principle of the reference before production, let system's setting of the parameter can effectively improve production yield.
Using ANSYS fluent that is software for fluid analysis to simulate situation of IC's junction temperature with temperature control system. To collocate fluid pressure setting of the chiller to study the effect of chillers parameters setting on IC's junction temperature.
The results shown fluid pressure of active thermal control system set 0.7Mpa to 0.75Mpa , get approaches to required junction temperature range of the IC during the testing. Although there are a lots thermal resistance layers in the thermal system ,and the thermal resistance between chip and heat sink affect the junction temperature of primary factor .
With buildup thermal systems for simulation analysis of active thermal control system in the handler , to obtained IC's thermal transfer relationship during the testing ,and compared verify actual junction temperature reading of the IC. In the future of the work, the study can be effectively used.
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