Analysis of Debond Propagation on the Polymer-Cu Thin-Film Interface

• Main Authors: Chia-KueiHsu, 許佳桂
• Other Authors: Tz-Cheng Chiu
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/88041417523300548010

碩士 === 國立成功大學 === 機械工程學系 === 104 === Debonding of dissimilar materials interface is a critical issue to be considered in the microelectronics industry. In this thesis debond propagation on the polymer-Cu thin-film interface is considered. The mixed-mode critical strain energy release rate of two polymer-Cu interfaces were measured by the four-point bending (4PB) fracture test, and effects of cleaning processing and moisture preconditioning to the interface adhesion were investigated. The fatigue debond growth rate of the interface of interest was also characterized under Mode-I cyclic loading by using a double cantilever beam (DCB) setup. The steady-state fatigue debond growth rate is found to display a power-law dependence on the strain energy release rate. By using numerical finite element simulation, the polymer-Cu debond growth driving force for a Cu-pad sidewall crack under thermal excursion was also obtained. The risk of critical debond growth along the sidewall was also evaluated by comparing the experimentally obtained fracture toughness to the numerically estimated debond driving force. The fatigue life of an interfacial crack can also be evaluated with the measured fatigue crack growth characteristics and the crack driving force.