Investigation of transfer behaviors of highly concentrated silver pastes on copper pad

• Main Authors: Shin-HauChen, 陳信豪
• Other Authors: Weng-Sing Hwang
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/79526413620755920395

碩士 === 國立成功大學 === 材料科學及工程學系 === 104 === In this study, we have demonstrated that the highly concentrated nano silver particles ink was precisely transferred on the small Cu pads. In order to understand the overflowing phenomenon, the effect of the waveform condition and the other printing condition was investigated. For the higher pulse range of +40 V-−22 V, the droplet diameters of 42 μm with an average velocity of 0.21 m•s−1 was produced; For the lower pulse range of +30 V-−20 V, the droplet diameters of 24 μm with an average velocity of 1.3 m•s−1 was produced. The droplet would overflow if the gap between nozzle and the copper pad is lower than 200 μm.The droplet transferred on the copper pad with OSP and without OSP doesn’t occur overflow. The droplet would not overflow if the distance between droplet and the copper pad center is lower than 35 μm.