Building the Chip Scale Package Model With Fluorescent powder

Building the Chip Scale Package Model With Fluorescent powder

碩士 === 國立中興大學 === 精密工程學系所 === 104

Bibliographic Details
Main Authors: Chun-Ping Chang, 張鈞評
Other Authors: 韓斌
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/65938952897467800501
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spelling ndltd-TW-104NCHU56930282017-01-06T04:19:42Z http://ndltd.ncl.edu.tw/handle/65938952897467800501 Building the Chip Scale Package Model With Fluorescent powder 晶粒尺度封裝之螢光粉模型建置 Chun-Ping Chang 張鈞評 碩士 國立中興大學 精密工程學系所 104 韓斌 2016 學位論文 ; thesis 91 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立中興大學 === 精密工程學系所 === 104
author2 韓斌
author_facet 韓斌
Chun-Ping Chang
張鈞評
author Chun-Ping Chang
張鈞評
spellingShingle Chun-Ping Chang
張鈞評
Building the Chip Scale Package Model With Fluorescent powder
author_sort Chun-Ping Chang
title Building the Chip Scale Package Model With Fluorescent powder
title_short Building the Chip Scale Package Model With Fluorescent powder
title_full Building the Chip Scale Package Model With Fluorescent powder
title_fullStr Building the Chip Scale Package Model With Fluorescent powder
title_full_unstemmed Building the Chip Scale Package Model With Fluorescent powder
title_sort building the chip scale package model with fluorescent powder
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/65938952897467800501
work_keys_str_mv AT chunpingchang buildingthechipscalepackagemodelwithfluorescentpowder
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AT chunpingchang jīnglìchǐdùfēngzhuāngzhīyíngguāngfěnmóxíngjiànzhì
AT zhāngjūnpíng jīnglìchǐdùfēngzhuāngzhīyíngguāngfěnmóxíngjiànzhì
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