A Study on Design of CMOS MEMS Paddle Cantilever Beam
碩士 === 國立中興大學 === 精密工程學系所 === 104 === In this thesis, we design a CMOS-MEMS paddle cantilever beam type pressure vacuum through CMOS-MEMS processing integration technology, which greatly reduces the size of vacuum gauge and its cost. Since the micro-fabrication process is highly compatible to genera...
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ndltd-TW-104NCHU56930182017-01-06T04:19:42Z http://ndltd.ncl.edu.tw/handle/92237408939970724054 A Study on Design of CMOS MEMS Paddle Cantilever Beam CMOS-MEMS微槳型懸臂樑感測器之設計探討 Kai-Long Chen 陳凱隆 碩士 國立中興大學 精密工程學系所 104 In this thesis, we design a CMOS-MEMS paddle cantilever beam type pressure vacuum through CMOS-MEMS processing integration technology, which greatly reduces the size of vacuum gauge and its cost. Since the micro-fabrication process is highly compatible to general IC process, both VLSI and micro-structure can coexist the same chip. In our experiment, the paddle cantilever beam type pressure vacuum of the MEMS sensing element, the drive system and the measurement system are integrated on a single chip, which present a Paddle cantilever beam by using post-process. By measuring the resonant frequency and decay rate, we also can find the correlation between the degree of vacuum and decay rate. In this thesis, there are 5 steps to design a CMOS-MEMS paddle cantilever beam type pressure vacuum, we use SPICE to design and simulate the VLSI, we use Solidworks to generate the MEMS structure, we apply Ansys to analyze. we use Laker to map the layout in accordance with the 180 nm Foundry Design Kit, and the chip is finally taped out by CIC. To sum up, the CMOS-MEMS paddle cantilever beam type pressure vacuum greatly reduces the size of vacuum gauge and its cost, making sensing element applied in vacuum system more effective. Ming-Tzer Lin 林明澤 2016 學位論文 ; thesis 54 zh-TW |
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碩士 === 國立中興大學 === 精密工程學系所 === 104 === In this thesis, we design a CMOS-MEMS paddle cantilever beam type pressure vacuum through CMOS-MEMS processing integration technology, which greatly reduces the size of vacuum gauge and its cost. Since the micro-fabrication process is highly compatible to general IC process, both VLSI and micro-structure can coexist the same chip. In our experiment, the paddle cantilever beam type pressure vacuum of the MEMS sensing element, the drive system and the measurement system are integrated on a single chip, which present a Paddle cantilever beam by using post-process. By measuring the resonant frequency and decay rate, we also can find the correlation between the degree of vacuum and decay rate. In this thesis, there are 5 steps to design a CMOS-MEMS paddle cantilever beam type pressure vacuum, we use SPICE to design and simulate the VLSI, we use Solidworks to generate the MEMS structure, we apply Ansys to analyze. we use Laker to map the layout in accordance with the 180 nm Foundry Design Kit, and the chip is finally taped out by CIC. To sum up, the CMOS-MEMS paddle cantilever beam type pressure vacuum greatly reduces the size of vacuum gauge and its cost, making sensing element applied in vacuum system more effective.
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author2 |
Ming-Tzer Lin |
author_facet |
Ming-Tzer Lin Kai-Long Chen 陳凱隆 |
author |
Kai-Long Chen 陳凱隆 |
spellingShingle |
Kai-Long Chen 陳凱隆 A Study on Design of CMOS MEMS Paddle Cantilever Beam |
author_sort |
Kai-Long Chen |
title |
A Study on Design of CMOS MEMS Paddle Cantilever Beam |
title_short |
A Study on Design of CMOS MEMS Paddle Cantilever Beam |
title_full |
A Study on Design of CMOS MEMS Paddle Cantilever Beam |
title_fullStr |
A Study on Design of CMOS MEMS Paddle Cantilever Beam |
title_full_unstemmed |
A Study on Design of CMOS MEMS Paddle Cantilever Beam |
title_sort |
study on design of cmos mems paddle cantilever beam |
publishDate |
2016 |
url |
http://ndltd.ncl.edu.tw/handle/92237408939970724054 |
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