Effects of Plating Additives on Microstructure and Preoperties of Eletrodeposited Ni-Fe Alloy
碩士 === 國立中興大學 === 化學工程學系所 === 104 === With the evolving technology, demand for electronic products such as smartphones become higher. The types of Smartphones become much thinner and more multi-functional. In order to meet the portability and convenience, it is necessary to reduce the volume of the...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01524885057763127261 |