Electrochemical Polishing Assisted by Time-Varying Magnetic Field

• Main Authors: Siang-Yi Hong, 洪祥益
• Other Authors: Yung-Fu Wu
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/4dw386

碩士 === 明志科技大學 === 化學工程系碩士班 === 104 === In this study, the electrochemical reaction of copper was carried out under a magnetic field. In our experiment, a two-electrode cell connecting with a potentiostat and a magnetic field generator was used. We employed sinusoidal and square types of magnetic field to enhance electrochemical polishing. The strength, direction and frequency of the magnetic field were controlled as well as the applied voltage. During the electrochemical treatment, anodic polarization curves and AC impedance spectroscopy were used to analyze the reaction. After the electrochemical treatment, the surface morphology was obtained using atomic force microscopy (AFM). It was found that the performance of electrochemical polishing can be enhanced by a varying magnetic field. It was found that a sine type of 0.2 T magnetic field parallel to current could give rise to the best polishing performance.