Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs

碩士 === 明新科技大學 === 電子工程系碩士班 === 104 === Planar field effect transistors in semiconductor industry have been used for a long time, playing a main role in the past. Since the process technology is promoted, the shrinkage of device profile is well done. However, this technology gradually approaches the...

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Main Authors: WANG,YU-WEI, 王昱崴
Other Authors: WANG,MU-CHUN
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/47365866755668715959
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spelling ndltd-TW-104MHIT06860012017-10-29T04:34:51Z http://ndltd.ncl.edu.tw/handle/47365866755668715959 Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs 不同n通道鰭式電晶體之爾利電壓變化與VT離子佈植能量之相依性 WANG,YU-WEI 王昱崴 碩士 明新科技大學 電子工程系碩士班 104 Planar field effect transistors in semiconductor industry have been used for a long time, playing a main role in the past. Since the process technology is promoted, the shrinkage of device profile is well done. However, this technology gradually approaches the physical limitation. Most of researchers or scientists seek the other available alternatives. A fin field effect transistor (FinFET) device seems a good choice in this process era. In this study, the FinFETs compared to the conventional planar field-effect transistors, increasing the transistor channel width (Wfin + 2Hfin), which is to make the drive current. This transistor device is formed on the Unibond SOI wafer structure, a channel thickness of about 80 nm deposited as Si crystalline layer. Using the hard mask, the Si-fin can be fabricated. To improve the drive current, FinFETs possibly offer the multi-channel scheme instead of the single-channel device. In this experiment, the channel-length modulation (CLM) is applied to explore the Early voltage (VA) in a FinFET device, which the L/L change is caused from the horizontal and vertical field of dependency in channel. Furthermore, the VA values for single or multi-channel FinFETs are related to the device profile, the temperature stress, and the VT implant energy. These relationships will also be investigated. Due to these efforts, the suitable device models will be provided to the IC design customers. In this measurement test, there is more influence to the VA as the tested device is single-channel mode operated at the lower electrical field (VGS-VT). For multi-channel tested devices, the VA is impacted obviously at the middle field or higher. As the stress temperature is increased, the channel lengths are different, or the VT implant energies are not the same, the VA is indeed influenced. However, the trend is not easy to be classified well. The speculation is possibly when the device profile is shrunk, the uniformity of VT implant is not optimally approached to cause the channel electrical field is not easy to be controlled well. WANG,MU-CHUN 王木俊 2016 學位論文 ; thesis 111 zh-TW
collection NDLTD
language zh-TW
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description 碩士 === 明新科技大學 === 電子工程系碩士班 === 104 === Planar field effect transistors in semiconductor industry have been used for a long time, playing a main role in the past. Since the process technology is promoted, the shrinkage of device profile is well done. However, this technology gradually approaches the physical limitation. Most of researchers or scientists seek the other available alternatives. A fin field effect transistor (FinFET) device seems a good choice in this process era. In this study, the FinFETs compared to the conventional planar field-effect transistors, increasing the transistor channel width (Wfin + 2Hfin), which is to make the drive current. This transistor device is formed on the Unibond SOI wafer structure, a channel thickness of about 80 nm deposited as Si crystalline layer. Using the hard mask, the Si-fin can be fabricated. To improve the drive current, FinFETs possibly offer the multi-channel scheme instead of the single-channel device. In this experiment, the channel-length modulation (CLM) is applied to explore the Early voltage (VA) in a FinFET device, which the L/L change is caused from the horizontal and vertical field of dependency in channel. Furthermore, the VA values for single or multi-channel FinFETs are related to the device profile, the temperature stress, and the VT implant energy. These relationships will also be investigated. Due to these efforts, the suitable device models will be provided to the IC design customers. In this measurement test, there is more influence to the VA as the tested device is single-channel mode operated at the lower electrical field (VGS-VT). For multi-channel tested devices, the VA is impacted obviously at the middle field or higher. As the stress temperature is increased, the channel lengths are different, or the VT implant energies are not the same, the VA is indeed influenced. However, the trend is not easy to be classified well. The speculation is possibly when the device profile is shrunk, the uniformity of VT implant is not optimally approached to cause the channel electrical field is not easy to be controlled well.
author2 WANG,MU-CHUN
author_facet WANG,MU-CHUN
WANG,YU-WEI
王昱崴
author WANG,YU-WEI
王昱崴
spellingShingle WANG,YU-WEI
王昱崴
Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
author_sort WANG,YU-WEI
title Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
title_short Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
title_full Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
title_fullStr Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
title_full_unstemmed Early-Voltage Variation and Dependence of VT Implant for n-type FinFETs
title_sort early-voltage variation and dependence of vt implant for n-type finfets
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/47365866755668715959
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