Reflow Process Optimization

• Main Authors: Huang , Jheng-Guo, 黃政國
• Other Authors: Chen, Yung-Yu
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/21896694260615147921

碩士 === 龍華科技大學 === 電子工程系碩士班 === 104 === SMT process comprises three main manufacturing processes: 1.solder paste printing 2.surface mount /placement 3. reflow. Reflow process is one of the most key points to influence the quality of PCBA soldering, and soldering condition directly affect the electronic product functionality, reliability and security. Reflow process contains 4 parts, 1.Preheater zone; 2.Soak Zone; 3.Reflow Zone; 4.Cooling Zone. Each step has its own temperature and time (which is called Reflow Profile) and this profile directly affect the electronic product functionality, reliability and security. While the profile curve can be controlled effective, some potential quality issues, such as Sn particle, tomb stone, chip rotate, crack, flux inactive, etc may reduce. We will discuss the model (YX-LFHACRF) parameters of 2 steps during reflow process in this paper, such as peak temperature, preheat time, in order to enhance strength and reliability of soldering.