The development of high- heat-resistant aluminum alloy bonding wire
碩士 === 國立高雄應用科技大學 === 模具系碩士在職專班 === 104 === Aluminum bonding wire is currently used as material for large-current semiconductors such as power devices. Recently, however, increased power density requirements for aerospace, automotive and deep well drilling applications mean that higher junction temp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/enmex7 |