Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 104 === The study explores and analyzes the procedure of semiconductor manufacturing, particularly on the defections found during photoresist coating, and how to prevent it from happening. The first part of study identifies the pro & con of different types of...

Full description

Bibliographic Details
Main Authors:	YANG, PING-HSUAN, 楊秉軒
Other Authors:	Cheng, Tseng-Chieh
Format:	Others
Language:	zh-TW
Published:	2016
Online Access:	http://ndltd.ncl.edu.tw/handle/d3bw5x

id	ndltd-TW-104KUAS0693150
record_format	oai_dc
spelling	ndltd-TW-104KUAS06931502019-05-15T22:53:47Z http://ndltd.ncl.edu.tw/handle/d3bw5x Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process 積體電路微影製程光阻塗佈機缺陷分析研究 YANG, PING-HSUAN 楊秉軒碩士國立高雄應用科技大學機械與精密工程研究所 104 The study explores and analyzes the procedure of semiconductor manufacturing, particularly on the defections found during photoresist coating, and how to prevent it from happening. The first part of study identifies the pro & con of different types of photoresist coated, and then categorizes various defections occur in the coating process. Analysis is then being conducted to find out the root cause of each type of defection. With the causes being identified, a couple experimental methods, e.g. maneuvering the maintenance procedure/timeframe or the pressure setting of the chamber, are presented and tested in order to refine the coating process, reducing the defect rate and increasing the yield rate. Cheng, Tseng-Chieh 鄭宗杰 2016 學位論文 ; thesis 61 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 104 === The study explores and analyzes the procedure of semiconductor manufacturing, particularly on the defections found during photoresist coating, and how to prevent it from happening. The first part of study identifies the pro & con of different types of photoresist coated, and then categorizes various defections occur in the coating process. Analysis is then being conducted to find out the root cause of each type of defection. With the causes being identified, a couple experimental methods, e.g. maneuvering the maintenance procedure/timeframe or the pressure setting of the chamber, are presented and tested in order to refine the coating process, reducing the defect rate and increasing the yield rate.
author2	Cheng, Tseng-Chieh
author_facet	Cheng, Tseng-Chieh YANG, PING-HSUAN 楊秉軒
author	YANG, PING-HSUAN 楊秉軒
spellingShingle	YANG, PING-HSUAN 楊秉軒 Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
author_sort	YANG, PING-HSUAN
title	Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
title_short	Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
title_full	Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
title_fullStr	Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
title_full_unstemmed	Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process
title_sort	analysis & improvement defect of spin coater on the vlsi lithography process
publishDate	2016
url	http://ndltd.ncl.edu.tw/handle/d3bw5x
work_keys_str_mv	AT yangpinghsuan analysisimprovementdefectofspincoateronthevlsilithographyprocess AT yángbǐngxuān analysisimprovementdefectofspincoateronthevlsilithographyprocess AT yangpinghsuan jītǐdiànlùwēiyǐngzhìchéngguāngzǔtúbùjīquēxiànfēnxīyánjiū AT yángbǐngxuān jītǐdiànlùwēiyǐngzhìchéngguāngzǔtúbùjīquēxiànfēnxīyánjiū
_version_	1719136517848301568

Analysis & Improvement Defect of Spin Coater on The VLSI Lithography Process

Similar Items