| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系博碩士班 === 104 === As the development of electronic components in the direction of miniaturization, high-power, and high integration, it requires more and higher performance, so the waste heat generated by the operation of components, need to be ruled out quickly, otherwise it will reduce the performance of electronic components. High thermal conductivity polymer composite materials with high thermal conductivity and high-performance are the most widely used in electronic components.
This study is using electrospinning method to prepare high thermal conductivity micron network Al2O3-Ag fillers, and applied to enhance thermal conductivity of Al2O3-Ag/epoxy composites. Commonly, to enhance thermal conductivity of polymer matrix composite via a large amount of thermal conductivity powders loading in matrix (ex: AlN). From the images of SEM, indicated the Al2O3-Ag fillers with 1-D micron network structure and high aspect ratio (> 50), and identified as cubic system Ag and rhombohedral system Al2O3 by XRD and TEM. From the spectra of FT-IR, confirmed the material surface grafted with siloxane. By a four-point probe tester detected the volume resistivity value, confirmed the Al2O3-Ag/epoxy composites is non-conductive material.
The Al2O3-Ag/epoxy composites using a thermal conductivity meter (Hot-Disk) to detect the heat transfer coefficient, was prepared the Al2O3-Ag fiber and modified Al2O3-Ag fibrous fillers, as 50 wt% addition amount of epoxy composite, the thermal conductivity were 0.77, 0.60 W/mK, respectively. And had 285% and 200% enhancement in thermal conductivity, respectively. This conclusion can be observed the filler which were modified has the better thermal conductivity, by using SEM observe the surface morphology of cross section can be found within the composites material is modified through the addition of materials and organic substrates interface significantly reduced, which can be attributed to the additional material bonded with an epoxy resin. DMA detects storage modulus and glass transition temperature, in addition to silane internal substrate material can effectively inhibit crack growth and storage modulus increases, but because of this situation hinders the crosslinked epoxy resin.
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