Effect of H-bond and Thermal Treatment on the Conductivity of Polymer/graphene nanocomposites

• Main Authors: CHEN, PO-JUI, 陳柏瑞
• Other Authors: HUANG,PING-TSUNG
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/07832417868139225235

碩士 === 輔仁大學 === 化學系 === 104 === The property enhancement of polymer/graphene nanocomposites is very sensitive to the dispersion of graphene in the polymer/graphene composites. To overcome the dispersion issue of graphene in polymer/graphene composites, a well-dispersed poly(styrene sulfonic acid) (PSS) and graphene oxide (GO) in water solution is prepared by stirring PSS with GO in water for three days through the H-bond formation between GO and sulfonated polymer. The GO/PSS and GO/SPAN films are thermally treated at 310 ℃ to remove the functional groups on GO and sulfonated polymer to form RGO/PS-liked and RGO/PANI-liked films. The oxygen-containing functional groups and sulfonic acid groups hinder the conductive network. And TGA and FT-IR study indicates that most oxygen-containing functional groups on GO can be removed by thermal-treated at 200 ℃ and the sulfonic acid groups can be removed at 310 ℃. XPS indicated the functional groups can be moved by thermal treatment in composites. XRD and TEM experiments show well-dispersed GO in the GO/PSS and GO/SPAN nanocomposites before and after thermal-treatment. The conductivities of different content GO in PSS and SPAN are measured by a 4-point probe machine. Conductivity measurements find the 15 wt% GO in PSS is 17.7 S/cm and the 25 wt% GO in SPAN is 687 S/cm. the results indicated the concept of H-bond and thermal treatment can improve the whole dispersity and conductivity.