8D increasing production efficiency for semiconductor assembly Die Attach equipment

• Main Author: 陳世欽
• Other Authors: 葉忠
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/y82746

碩士 === 逢甲大學 === 工業工程與系統管理學系 === 104 === The semiconductor industry as an important Strategic industry in Taiwan, in the face of continuous innovation semiconductor manufacturing process, how the products used in the manufacturing process, the implementation of rapid maintenance of difference compared to the same time to achieve increased efficiency and yield goals, becoming in equipment maintenance field a major challenge. The purpose of this paper is through case studies, machine parts before and after the improvement in the quality of the semiconductor product yield and machine equipment operation, actual performance can be improved efficiency, as well as efficiency gains made concrete and feasible for future direction. Examples of verification from found in the difference between the old parts and Modified parts of the machine before the job implementation of modified maintenance can improve the yield and enable maintenance rate decreased, the yield increase, artificially reducing abnormal (lower repair machine), Therefore, this method is applicable to packaging machine production on efficiency improvement.