| Summary: | 碩士 === 中原大學 === 工業與系統工程研究所 === 104 === Lithography responsible for all layouts in the wafer manufacture process which is complicated and slight. Thus, wafer inspection process plays an important role on product performance. Except Automatic Optical Inspection(AOI), another important method is operator inspect wafers by microscope. This study investigates the effects of operator visual fatigue and measurement performance.
This study combined two different measurement shapes (circle, linear) and three measurement periods (20mins, 40mins and 60mins). Operator’s measurement performance (failure rate, inspection times) and visual fatigue performance (critical flicker fusion frequency, visual fatigue subjective questionnaires) would be collected as the evaluations. The results show that both measurement shapes and measurement periods showed statistically significant difference on failure rate and measurement times. Thus, measurement period controlling can be an improve plan for better measurement performance while measurement sharp is fixed in actual operation. Second, only measurement periods showed statistically significant difference on visual fatigue, not measurement sharps.
In summary,
1. Include operation measurement period as indicator on improving Cpk of inspection performance requires to and find the optimized range.
2. Find the marginal area of visual fatigue by critical flicker fusion frequency to improve operator measurement performance.
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