The Study of Improving the Yield of Wire Bonding Process for IC Packaging by Using the Design of Experiment and Response Surface Methodology
碩士 === 中原大學 === 工業與系統工程研究所 === 104 === There has been a lower gross era for Taiwanese assembly and testing industry. So how to enhance the production efficiency and lower production cost are big issues to this industry. The major bottleneck of IC packaging is how to reduce the cost in the wire bon...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85512143184956997252 |