The Study of Improving the Yield of Wire Bonding Process for IC Packaging by Using the Design of Experiment and Response Surface Methodology

• Main Authors: Ying-Yu Tsui, 崔贏友
• Other Authors: Yung-Tsan Jou
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/85512143184956997252

碩士 === 中原大學 === 工業與系統工程研究所 === 104 === There has been a lower gross era for Taiwanese assembly and testing industry. So how to enhance the production efficiency and lower production cost are big issues to this industry. The major bottleneck of IC packaging is how to reduce the cost in the wire bonding process. If a company can improve the cost efficiency of wire bonding, there will improve the cost saving. This research collected data from Case Company A. the main problem to Case Company A is the abnormal shape of silver ball when operating. Thus, Taguchi Method of the Design of Experiment (DOE) are employed to explore the influential factors, and then find out the optimal parameters by response surface methodology (RSM) to improve the problem of silver balls. Three main influential factors are discovered, including bond force, tail cut speed, and spark current. Then, the Central Composite Design of RSM is used to explore the optimal parameters. Research findings show that the yield shifts from 95.79% to 99.58% as wire bonding process improved. This research provide an example to assembly and testing industry in improving the production efficiency and cost saving.