Study on the process improvement by Six-Sigma and TRIZ
碩士 === 中原大學 === 工業與系統工程研究所 === 104 === “I never think of the future – it comes soon enough”, said Albert Einstein. As the semiconductor packaging technology advances, a series of challenges arise. When customer requirements no longer just focus on the high quality of products (requirements on heat d...
Main Authors: | Wei-Ming Lai, 賴偉銘 |
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Other Authors: | Kang-Hung Yang |
Format: | Others |
Language: | zh-TW |
Published: |
2016
|
Online Access: | http://ndltd.ncl.edu.tw/handle/82649726560241327948 |
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