Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan
碩士 === 中華大學 === 企業管理學系 === 104 === Taiwan IC packaging and testing output value fell 2.8 percent from the previous year NT$ 453.9 billion to 441.3 NT$ billion in 2015 according to Industry & Technology Service (IT IS).Taiwan IC packaging business production value was NT$ 309.9 billion, fell 1.9...
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ndltd-TW-104CHPI03210182019-05-15T22:42:55Z http://ndltd.ncl.edu.tw/handle/5865v9 Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan 市場結構、廠商行為與營運績效-以台灣IC封裝測試產業為例 Wu,Shr-Wei 吳世偉 碩士 中華大學 企業管理學系 104 Taiwan IC packaging and testing output value fell 2.8 percent from the previous year NT$ 453.9 billion to 441.3 NT$ billion in 2015 according to Industry & Technology Service (IT IS).Taiwan IC packaging business production value was NT$ 309.9 billion, fell 1.9 percent year-on yea NT$ 316.0 billion ,and the local IC testing segment production value fell 4.7 percent from the previous year 137.9 NT$ billion to NT$131.4 billion. In 2014, the production value of IC packaging and testing grew 10.4 percent year-on-year 411.0 NT$ billion with the growing demand of smart phone and Tablet. The global economic recession occurred, one of reasons is the oil price and China stock market plunged in 2015 , the other reason is booming economy in 2014,which also induced high base period and packaging and testing industries declined. Under decreasing crude oil production which causing stable oil price and Internet of Things terminal products, it is expected to see its output value rise to 2.7 percent and meet the goal of NT$ 453.0 billion in 2016. For decades , semiconductor industry has been one important part of Taiwan industries, this study aims to analyze and explore the market structure、conduct and performance. Then it can provide some related suggestions for relevant industries and government , furthermore, improving its steady growth and sustainable core competence. Based on Mason-Bain’s “structure –conduct-performance”, the study explores semiconductor industry structure –conduct- performance. First, the study recognizes Four-firm concentration ratio, CR4 and Herfindahl- Hirschman Index(HHI) as measuring market concentration index. Second, the research uses SWOT、4P and Porter five forces analysis as a theory foundation for semiconductor packaging and testing industries、managing development , also, exploring the industry management and development tactics .Third, the study probes into its operating situation on Taiwan IC packaging and testing firms . Fourth, through studying and interviewing cases , the study discovered the management policy、competence and the future development about the industry. Researchers found the result: Firstly, CR4 is between 80 and 85 percent from 2007 to 2015 within these nine years, and HHI is between 2200 and 3500. It is obvious that Taiwan tend to high concentration market from 2007 to 2015, the two index is consistent according to combining the two index value result .Taiwan top four firms on IC packaging and testing firms take 70 percent share of Taiwan whole revenue , it becomes the situation that the bigger the stronger.. Secondly, according to firm behavior , Taiwan will continue to research and develop the technique of packaging and testing high-end products for orders and exploit China and the other new markets . Thirdly, according to their performances of Taiwan top four firms on IC packaging and testing sectors, the best one is Powertech Technology Inc,the second one is Advanced Semiconductor Engineering, Inc , the third one is Siliconware Precision Industries Co., Ltd, and the last one is ChipMOS Technologies Inc. Fourthly, case company –Sigurd Mocroelectronics Corp is an independent supplier for semiconductor packaging and testing OEM service, possesses the most advanced technological、 equipment、 technique and production line throughout Taiwan and China. It can provide complete package semiconductor back-end-of -the-line for customers , earning per share is NT$ 2.29 in these nine years, and becomes a steady development packaging and testing firm. Teng, Ruey-Jaw 鄧瑞兆 2016 學位論文 ; thesis 101 zh-TW |
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碩士 === 中華大學 === 企業管理學系 === 104 === Taiwan IC packaging and testing output value fell 2.8 percent from the previous year NT$ 453.9 billion to 441.3 NT$ billion in 2015 according to Industry & Technology Service (IT IS).Taiwan IC packaging business production value was NT$ 309.9 billion, fell 1.9 percent year-on yea NT$ 316.0 billion ,and the local IC testing segment production value fell 4.7 percent from the previous year 137.9 NT$ billion to NT$131.4 billion. In 2014, the production value of IC packaging and testing grew 10.4 percent year-on-year 411.0 NT$ billion with the growing demand of smart phone and Tablet. The global economic recession occurred, one of reasons is the oil price and China stock market plunged in 2015 , the other reason is booming economy in 2014,which also induced high base period and packaging and testing industries declined. Under decreasing crude oil production which causing stable oil price and Internet of Things terminal products, it is expected to see its output value rise to 2.7 percent and meet the goal of NT$ 453.0 billion in 2016. For decades , semiconductor industry has been one important part of Taiwan industries, this study aims to analyze and explore the market structure、conduct and performance. Then it can provide some related suggestions for relevant industries and government , furthermore, improving its steady growth and sustainable core competence.
Based on Mason-Bain’s “structure –conduct-performance”, the study explores semiconductor industry structure –conduct- performance. First, the study recognizes Four-firm concentration ratio, CR4 and Herfindahl- Hirschman Index(HHI) as measuring market concentration index. Second, the research uses SWOT、4P and Porter five forces analysis as a theory foundation for semiconductor packaging and testing industries、managing development , also, exploring the industry management and development tactics .Third, the study probes into its operating situation on Taiwan IC packaging and testing firms . Fourth, through studying and interviewing cases , the study discovered the management policy、competence and the future development about the industry.
Researchers found the result: Firstly, CR4 is between 80 and 85 percent from 2007 to 2015 within these nine years, and HHI is between 2200 and 3500. It is obvious that Taiwan tend to high concentration market from 2007 to 2015, the two index is consistent according to combining the two index value result .Taiwan top four firms on IC packaging and testing firms take 70 percent share of Taiwan whole revenue , it becomes the situation that the bigger the stronger.. Secondly, according to firm behavior , Taiwan will continue to research and develop the technique of packaging and testing high-end products for orders and exploit China and the other new markets . Thirdly, according to their performances of Taiwan top four firms on IC packaging and testing sectors, the best one is Powertech Technology Inc,the second one is Advanced Semiconductor Engineering, Inc , the third one is Siliconware Precision Industries Co., Ltd, and the last one is ChipMOS Technologies Inc. Fourthly, case company –Sigurd Mocroelectronics Corp is an independent supplier for semiconductor packaging and testing OEM service, possesses the most advanced technological、 equipment、 technique and production line throughout Taiwan and China.
It can provide complete package semiconductor back-end-of -the-line for customers , earning per share is NT$ 2.29 in these nine years, and becomes a steady development packaging and testing firm.
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author2 |
Teng, Ruey-Jaw |
author_facet |
Teng, Ruey-Jaw Wu,Shr-Wei 吳世偉 |
author |
Wu,Shr-Wei 吳世偉 |
spellingShingle |
Wu,Shr-Wei 吳世偉 Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
author_sort |
Wu,Shr-Wei |
title |
Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
title_short |
Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
title_full |
Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
title_fullStr |
Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
title_full_unstemmed |
Market Structure,Firm Conduct, and Performance-A Case Study of the IC Packing and Testing Industry in Taiwan |
title_sort |
market structure,firm conduct, and performance-a case study of the ic packing and testing industry in taiwan |
publishDate |
2016 |
url |
http://ndltd.ncl.edu.tw/handle/5865v9 |
work_keys_str_mv |
AT wushrwei marketstructurefirmconductandperformanceacasestudyoftheicpackingandtestingindustryintaiwan AT wúshìwěi marketstructurefirmconductandperformanceacasestudyoftheicpackingandtestingindustryintaiwan AT wushrwei shìchǎngjiégòuchǎngshāngxíngwèiyǔyíngyùnjīxiàoyǐtáiwānicfēngzhuāngcèshìchǎnyèwèilì AT wúshìwěi shìchǎngjiégòuchǎngshāngxíngwèiyǔyíngyùnjīxiàoyǐtáiwānicfēngzhuāngcèshìchǎnyèwèilì |
_version_ |
1719134457624002560 |