Analysis of High Speed Transmission with Cascaded Discrete Lump Elements

• Main Authors: Jian-Ren Wang, 王建仁
• Other Authors: Heng-Tung Hsu
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/4jw35y

碩士 === 元智大學 === 通訊工程學系 === 103 === The motif of this thesis to research periodic impedance caused by periodic structure and analysis of cascading test fixture (Module Compliance Board、Host Compliance Board and SFP+ connector) for SFP+ cable. 　　Periodic impedance caused by periodic structure in transmission line, the dip trend of insertion loss, which is also called as suck-out effect. Suck-out effect not only simulated by high frequency 3D EM simulators also simulated RF/MMW circuit simulator, with proper number of sections, under the condition of quasi-static, the lumped circuit model could also perform the suck-out effect due to the periodic structure up to several tens GHz frequency range. 　　Analysis of cascading test fixture (Module Compliance Board、Host Compliance Board and SFP+ connector) for SFP+ cable simulated by EM simulator and using vector network analyzer to validate frequency domain and time domain results. From the simulation and measurement data, although the connector at a discontinuous transition can achieve impedance matching, the equivalent of LC tank due to matching structure will contribute to transmission zero in frequency response, deep in Sdd21. Furthermore, the near-end crosstalk, NEXT, is also increased at those frequencies.