| Summary: | 碩士 === 元智大學 === 通訊工程學系 === 103 === The motif of this thesis to research periodic impedance caused by periodic structure and analysis of cascading test fixture (Module Compliance Board、Host Compliance Board and SFP+ connector) for SFP+ cable.
Periodic impedance caused by periodic structure in transmission line, the dip trend of insertion loss, which is also called as suck-out effect. Suck-out effect not only simulated by high frequency 3D EM simulators also simulated RF/MMW circuit simulator, with proper number of sections, under the condition of quasi-static, the lumped circuit model could also perform the suck-out effect due to the periodic structure up to several tens GHz frequency range.
Analysis of cascading test fixture (Module Compliance Board、Host Compliance Board and SFP+ connector) for SFP+ cable simulated by EM simulator and using vector network analyzer to validate frequency domain and time domain results. From the simulation and measurement data, although the connector at a discontinuous transition can achieve impedance matching, the equivalent of LC tank due to matching structure will contribute to transmission zero in frequency response, deep in Sdd21. Furthermore, the near-end crosstalk, NEXT, is also increased at those frequencies.
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