Heat Dissipation Improvement Design And Signal Integrity Analysis For Quad Small Form-Factor Pluggable Connector

• Main Authors: Hsu Ming-Chun, 許名均
• Other Authors: Hung-Wen Lin
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/02648597446588912351

碩士 === 元智大學 === 電機工程學系 === 103 === For the electric connector between the data transceiver and the communication channel, the rapid increase of data rate and bus channel density results in some problems of heat sink, characteristic impedance mismatch, EMI and cross-couple noise. This thesis focus on the design of the Quad Small Form-factor Pluggable (QSFP)type connectors to improvement the heat sink performance and characteristic impedance. With highly reduced combinations of different size parameters, Taguchi Methods are utilized to enhance the size design of the heat sink of QSFP connector and to find the relationship among different parameters. To analysis the thermal distribution and verify the performance, FLOW SIMULATION is used to simulate the overall system includes connector, heat sinker and fan performance, In addition to heat sink, this thesis propose to modify the plastic insertion architecture among the pins of QSFP connectors to create an air convection flow channel which speed up the thermal dissipation, with realistic experiments and a 50℃ of environment temperature setup ,the measured operation temperature of conventional connector is 72.2℃ in average, while the modified connectors is 66.3℃ in average. Finally, this thesis use electromagnetic software to simulate the high frequency characteristic performance and S-parameters of QSFP connector ,simulations results reveal that this connector modification cause a better characteristic impedance matching than the conventional connector. Besides, a more smooth notch curve is observed in the band high than oscillation frequency.