Effect of Phosphorus Content on the Interfacial Microstructure and Mechanical Properties of the Solder Joints
碩士 === 元智大學 === 化學工程與材料科學學系 === 103 === Recently, replacement of electroless nickel/electroless palladium/immersion gold (i.e., Ni-P/Pd-P/Au, ENEPIG) surface finish by the Pd(P)/Au dual layer (EPIG) on the Cu pads is being considered and adopted by the electronics industry. This is because the prese...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/m226u2 |