| Summary: | 碩士 === 國立雲林科技大學 === 工業工程與管理系 === 103 === It is a height of technology-driven age, Electronic products seek is the appearance of thin and strong, internal multi-function and Using a long time. Early 1963 by the United States developed the Surface Mount Technology, Primarily imported computers, communications, military, industrial automation. Years of development SMT technology the originally been Printed circuit board transformed into Flexible Printed Circuit. The development and production of SMT included the material substance, mechanical action and physical principles. So that the production process is full of many production variables combination, Instability of caused by quality.
In this study, Company F the welding quality of production process to discuss, In the printing pressure, mounter height and oven temperature for three factors. After using design of experiments and Minitab software to analysis, The results of the experiment of imported parameters production, Bad welding quantity decreases from 257 points to 23 points, 91% improvement in the number of adverse, it's really exclude abnormal Flexible Printed Circuit as welding, Improve product the quality, reduce the risk of subsequent abnormal production of customer complaints
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