Application of Taguchi Method for Improving Die Saw Quality in Assembly Process
碩士 === 國立雲林科技大學 === 工業工程與管理系 === 103 === It is very important key element for wafer Die-Saw process and it also plays critical process in packaging technology. In Wafer Die-Saw process if there is a huge chipping issue, the strength of the wafer will be affected. Especially, the Front side chipping...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/x76rr4 |