| Summary: | 碩士 === 國立雲林科技大學 === 工業工程與管理系 === 103 === It is very important key element for wafer Die-Saw process and it also plays critical process in packaging technology. In Wafer Die-Saw process if there is a huge chipping issue, the strength of the wafer will be affected. Especially, the Front side chipping and Back side chipping the both issue were happened in Wafer Die-Saw, it could cause the wafer chipping area cracked if pressure from outside after Wafer Die-Saw process. It is very huge impact on wafer quality.
The study was applied with Taguchi method design to find out the critical elements that could affect the process capability. In order to improve the capability of process, through the experiment analysis to gain the best parameters, improving the quality of front side chipping and back side chipping process. This study is taking one case of single wafer product for example, using the best parameter combination, it has boosted the Cpk from 1.43 to 1.99 for front side chipping and the back side chipping it has boosted the Cpk from 1.49 to 1.87. Through the SPC method, in 95% average, the front side chipping average is from 13.35µm down to 6.43 µm. It has worked for upgrading the capability of process and it also has minimized for the waste of cost.
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