The Trend Study of Optimal Operation Parameters for Plasma Cleaning in LED Package Processes
碩士 === 育達科技大學 === 企業管理所 === 103 === Before the wire bonding process, the most common plasma detersive processing chip oxide layer and produce a lead frame that is in LED manufacturer processes currently. The main purpose of this process is strengthening gold eutectic on chip and lead frame and incre...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31191406606018530001 |