Study on Precision Polishing Method Applied to the Processing of Alumina Ceramics

• Main Authors: Yu-Wei Huang, 黃育威
• Other Authors: Kun-Lin Wu
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/36972716810029789472

碩士 === 東南科技大學 === 機械工程研究所 === 103 === This paper is about the study on the impact of machine polishing processing parameters on surface defect and surface roughness of processed alumina ceramics. In this study the abrasives of different diameters, the polishing liquids of different concentrations, and the different parameter settings have been applied to the grinding and polishing of alumina ceramics before investigating the surface roughness and surface topography of specimen. In this experiment the ceramic specimens are placed in between the ceramic working ring and grinding disc for grinding. The alumina grinding liquid with particle diameter of 10μm is used for preliminary grinding for 15 minutes such that the roughness is reduced to 14.9μm, and then the silicon carbide polishing liquid is used for polishing. The concentration, particle diameter, load, number of rotations, and time of polishing liquid will be changed during polishing process in order to observe the polishing effect of ceramic material under different parameters. The experimental analysis results have proven that the silicon carbide with diameter of 2μm in conjunction with duration of 50min, axial load of 9 kg, grinding disc rotation speed of 90 rpm, and concentration of 35% can result in the surface roughness of alumina ceramic reduced from the original 3.41μm to 0.22μm with an improvement rate of 93%. Under the observation by SEM and 3D surface profiler, the surface of specimen has been converted from an uneven surface into a rather smooth and flat surface.