Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating
碩士 === 國立臺北科技大學 === 機電整合研究所 === 103 === There will always be internal stress produced on a substrate during electroplating and it will cause deformation of the substrate. Large internal stresses will cause cracks or reduce the coating adhesion. There are many internal stress real-time measurement de...
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| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/p4k387 |