Summary: | 碩士 === 南臺科技大學 === 光電工程系 === 103 === A major decline in an organic light-emitting diode (OLED) device performance
is caused by the water vapor and oxygen permeability, which result in the formation
of black spots in OLEDs, reducing their light output and lifetimes.
In this study, Multi-Walled Carbon Nanotubes (MWNTs) were synthesizedon a
silicon substrate at relatively low temperature 500℃,using an Electron Cyclotron
Resonance Chemical Vapor Deposition (ECR-CVD). Mixing gases of Methane (CH4)
and Nitrogen (N2) were used as carbon source and the plasma treated 3-nm-thick Ni
film as catalyst. The other method to fabricate Carbon Nanotubes(CNT) samples is
sand blasting. UV glue is spin-coated on glass as an adhesive, and then MWNTs
powder can be attached onto the glass by sand-blast technique.To enhance the surface
hydrophilicity, the surface of (CNTs) is functionalized by C2H5OH treatment, oxygen
plasma or UV/Ozone treatment.
The surface morphologies and microstructures of carbon nanotubes are examined
by scanning electron microscopy (SEM), and functionalization of carbon nanotubes
are examined by the Fourier Transform Infrared Spectroscopy (FTIR) to analysis the
chains.The results show that ECR-CVD grown CNTs reveal vertically aligned
character and the length of CNTs is varied from 1.8 to 4.5 μm. The vertically aligned
character results in a good moisture absorption property by trapping the chains of
water molecules near the nanotubes surface via the pores in adjacent nanotubes.
Different samples, such as CNTs/Si, CNTs/UV glue/glass and CNTs/glass are
used as back plates for OLED encapsulations.The heat dispersion properties of back
plates are characterized by thermal imaging camera at OLED luminance of 24,000
cd/m2.The results show that the longer CNTs have the better thermal dispersion. For
different back plates, theproperties of thermal dispersion are CNTs/Si or CNTs/glass >
CNTs/UV glue/glass> glass.
The purpose of this study is using CNT as hygroscopic agent in OLED encapsulation
to enhance hygroscopic and improve thermal dispersion.
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