Development of fabrication process for integrated-circuit package using cooper as the bonding material
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 103 === This paper is to explore the structure of the semiconductor IC loaded, Gold copper process technology to convert extended Discussion material into whether caused by differences in the quality and yield of wire work,And with experiments to prove the feasibil...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a9y7pw |