Development of fabrication process for integrated-circuit package using cooper as the bonding material

• Main Authors: Yao-Ching Tsai, 蔡耀慶
• Other Authors: 莊為群
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/a9y7pw

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 103 === This paper is to explore the structure of the semiconductor IC loaded, Gold copper process technology to convert extended Discussion material into whether caused by differences in the quality and yield of wire work,And with experiments to prove the feasibility of the conversion process. This study is the use of copper wire material Wire material 20μm in diameter,Observed the conversion process gold and copper manufacturing process differences in experimental testing,Introduction This paper also describes the operation principle and analysis bonders wire job action,Import parameters wire bonders and related laboratory tests. First, this experiment can be divided into several key observations,The first parameter gold manufacturing process after the import of copper manufacturing process and the machine is functioning smoothly,And whether it can successfully expand job test,Job process will cause any kind of material physical changes,These issues related to this paper will study the nature of the instructions,The second is to observe the characteristic copper ball bonding wafer stick aluminum pad,And the use of electron microscopy ball changes,And guide the feet wrinkles seam point adhesion effect extension,The third is exported after the completion of the best wire job parameters,Confirm copper balls observed defect type, thickness size, height and Angular arc, and crow''s feet appearance inspection,And specifications for copper ball bad,crow''s feet and other effects of poor welding sticky unusual circumstances,The exclusion device toward arguments for abnormal changes. Finally, experimental results,Use copper ball thrust and pulling force sewing point the presentation of data to prove that,Copper wire bonding process in feasibility work.