New self-assembled Method of Additives on the Advanced Copper Electroplating for Application of Microelectronic
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 103 === This study is investigated for new self-assembled method of two stage. At first stage as dipping, the accelerator promotes to reduction for copper ions in microvia. At second stage as electroplating, suppressor and leveler inhibits to reduction for copper io...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75948789408263841953 |