Study of Epoxy on Molding Wire Sweep in IC Package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Recently the development of IC becomes tremendous and the function becomes diversify. The number of lead frame increases a lot and the wire design becomes complex to meet the function of IC. The molding control becomes an issue in the IC package...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24322290687352628399 |
| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Recently the development of IC becomes tremendous and the function becomes diversify. The number of lead frame increases a lot and the wire design becomes complex to meet the function of IC. The molding control becomes an issue in the IC package process.
This thesis studied the wire sweep behavior in molding process. Three different mold materials were applied first to study the wire sweep behavior. Then, study of two materials with different mold temperature were accessed to realized the effect of temperature. The SAT, X-ray image and open-short test were applied for characterization. Results show that the material viscosity and mold temperature both dominate the yield of wire sweep. With controlled mold material and process parameter, high IC package yield can be achieved.
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