The study of molding conditions on Adhesion Force of Mold and packaging materials
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === In general, molding compound residual can occur due to high temperature and high pressure in molding process, and this residual become hard to be removed when limit times of process, and mold chase cleaning is necessary. The main goal of this th...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/d8nybr |