The Study of Void Defects in FCBGA Molding Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Voids are usually occurred in molding process which is a close space of high temperature and pressure condition, and will produce liability issues such as solder extrusion and bridge to short. Usually, void defects is affected by parameters of m...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/54f8s3 |
| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Voids are usually occurred in molding process which is a close space of high temperature and pressure condition, and will produce liability issues such as solder extrusion and bridge to short. Usually, void defects is affected by parameters of mold chase vacuum condition, interfacing mechanism between substrate and molding compound, and process control factors. This thesis is focused on the study of the effects of mold temperature、pressure、process time and mold chase condition for a optimized mold process control. Scanning acoustic tomography (SAT) and scanning electron microscope (SEM) are used to scan the cross section at the location of voids and analyzed to explore the correlation of the voids generation due to the parameters of molding process control.
|
|---|