Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit

• Main Authors: Yu-yung Wu, 吳俞詠
• Other Authors: Sung-mao Wu
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/05116095099772509754

碩士 === 國立高雄大學 === 電機工程學系碩士班 === 103 === With high-frequency, high-speed circuit design and low power consumption of electronic products, the stability of dielectric material with frequency and the voltage noise margin are significant gradually. At the beginning of circuit design, when the relationship between dielectric material and frequency is obtained previously, the circuit design would meet the actual specifications to avoid circuit in the unintended effects. In order to reduce power consumption, the designer would take low voltage. But, such small amount of noise would make the bias voltage change. Moreover, the characteristics of circuit are changed. Therefore, power integrity issues become the primary solution designers target. This paper is divided into two parts. First, technology of electrical characteristics extraction by micro-strip is proposed. The wavelength variation of micro-strip and power consumption is derived extraction method. Second, the inverter chip is used to investigate EMI of different BGA package structures. With different power delivery network (PDN) and signal paths design, the situation of the inverter chip and EMI of different signal paths are analyzed completely by near-field scan system.