Study on the Tool Life of Diamond Coated Wire
碩士 === 國立臺灣科技大學 === 機械工程系 === 103 === In order to increase wafer production, the semiconductor industry constantly advances the slicing process efficiency, such as increasing wire speed and feed rate. The use of diamond coated wire as the primary slicing tool is inevitable to enhance the efficiency...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19210302899200517976 |