Multiphysics Modeling and Analysis of Heat Transfer of Wafer on Electrostatic Chuck

碩士 === 國立臺灣大學 === 應用力學研究所 === 103 === The complete heat transfer path on the AlN and Al2O3 electrostatic chuck (ESC), which were utilized under the various operational conditions, is studied for the potential improvement on the temperature uniformity of the 12-inch wafer. In addition, an identical...

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Bibliographic Details
Main Authors: Kuo-Chan Hsu, 徐國展
Other Authors: Jaw-Yen Yang
Format: Others
Language:en_US
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/94017791514088102106

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