| Summary: | 碩士 === 國立臺灣大學 === 應用力學研究所 === 103 === In recent years, active-matrix organic light-emitting diode (AMOLED) extensively used in electronic devices’ screen such as mobile phones, tablet PCs and TVs. However, the features such as self-illuminating, wide viewing angle, high contrast, fast response and low power consumption make it become the development priorities of the panel industry. In the future development, the flexible AMOLED is the key technology of the next generation. Unfortunately, the low yield rate in the manufacturing process cannot lead to mass production. Therefore, in order to seize market opportunities, the panel industry leader, such as Korea and Taiwan, are now solving the problems of manufacture.
The purpose of this study is to improve the yield rate of de-bonding process. However, the delamination and corner phenomenon are the major failure mechanism which can easily observed in the experiment. Therefore, this study establishes the FlexUP model by using traction separation law to quantify the properties of de-bonding layer which can be defined by Double cantilever beam theory.
According to the FlexUP model, the simulation calculates the stress between inner layers with weak bonding and also provides parameter analysis to achieve the optimal model, such as the stiffness of the porous material and sucker and the preserve length of the sucker. In addition, another model for dual carrier board which follows the theory of single carrier model provides preliminary estimate and experimental proposals in the future.
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