Effect of Residual Stresses on De-bonding Problems for Flexible Electric Devices
碩士 === 國立臺灣大學 === 應用力學研究所 === 103 === This research gives an introduction on AMOLED peeling technique. It includes the methods commonly used by the industry, and the FlexUP technique introduced by the ITRI. Through the introduction, it helps explain the technical difficulties associated with the Fle...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10704060739749835378 |