The Electrochemical Study of Polish Pad and Slurry on Cu/Ru Chemical Mechanical Polishing
碩士 === 國立臺灣大學 === 化學工程學研究所 === 103 === In this study the chemical mechanical polishing of copper and ruthenium in hydrogen peroxide and ammonium persulfate system has been investigated. Hydrogen peroxide or ammonium persulfate was employed as an oxidant in slurries. Either dish scrubber or regular p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55082851074215573444 |