How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.

碩士 === 國立臺南大學 === 經營與管理學系科技管理碩士在職專班 === 102 === Convenience of life science and technology, leading to smart technology products dependent increase in demand caused explosion, catalyzed the rapid evolution of semiconductor manufacturing technology. Wafer production capacity to follow Moore's La...

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Main Authors: Liu, Tsung-Yu, 柳宗佑
Other Authors: Liu, Tzu-Hsin
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/43988009690947568404
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spelling ndltd-TW-103NTNT12300012016-03-11T04:13:32Z http://ndltd.ncl.edu.tw/handle/43988009690947568404 How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation. 技術創新如何影響動態能力之發展:艾司摩爾(ASML)公司之個案研究 Liu, Tsung-Yu 柳宗佑 碩士 國立臺南大學 經營與管理學系科技管理碩士在職專班 102 Convenience of life science and technology, leading to smart technology products dependent increase in demand caused explosion, catalyzed the rapid evolution of semiconductor manufacturing technology. Wafer production capacity to follow Moore's Law continues to grow, the demand for computing power also increased chip complexity of the design harder. Rapidly changing environment in the semiconductor industry, the fierce market competition, new technologies continue to be improved and developed, and equipment suppliers only technically innovative research and development in order to maintain a competitive advantage in the marketplace. In this study, the company from its inception in 1984, continued technology development for lithography equipment. In historical perspective lithography equipment for 30 years of success, to analyze the business cycle in the semiconductor uncertainties. The enterprise continues to invest R & D, focusing on technological innovation, the ability to choose from a dynamic technology strategy and implementation possibility. Instead, identify their dynamic capabilities via its own resources and abilities to obtain the relevant core technology suppliers through mergers and acquisitions to accelerate the growth of dynamic capabilities within the enterprise, continued for wafer manufacturing technology development. In the competitive environment of lithography equipment industry enterprises use their own resources and capabilities to create competitive advantage. And maintain the manufacturing cost advantages through the most advanced manufacturing technology IC chip manufacturers and semiconductor process successfully branched out into the next generation miniature. Liu, Tzu-Hsin 劉子歆 2014 學位論文 ; thesis 80 zh-TW
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language zh-TW
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description 碩士 === 國立臺南大學 === 經營與管理學系科技管理碩士在職專班 === 102 === Convenience of life science and technology, leading to smart technology products dependent increase in demand caused explosion, catalyzed the rapid evolution of semiconductor manufacturing technology. Wafer production capacity to follow Moore's Law continues to grow, the demand for computing power also increased chip complexity of the design harder. Rapidly changing environment in the semiconductor industry, the fierce market competition, new technologies continue to be improved and developed, and equipment suppliers only technically innovative research and development in order to maintain a competitive advantage in the marketplace. In this study, the company from its inception in 1984, continued technology development for lithography equipment. In historical perspective lithography equipment for 30 years of success, to analyze the business cycle in the semiconductor uncertainties. The enterprise continues to invest R & D, focusing on technological innovation, the ability to choose from a dynamic technology strategy and implementation possibility. Instead, identify their dynamic capabilities via its own resources and abilities to obtain the relevant core technology suppliers through mergers and acquisitions to accelerate the growth of dynamic capabilities within the enterprise, continued for wafer manufacturing technology development. In the competitive environment of lithography equipment industry enterprises use their own resources and capabilities to create competitive advantage. And maintain the manufacturing cost advantages through the most advanced manufacturing technology IC chip manufacturers and semiconductor process successfully branched out into the next generation miniature.
author2 Liu, Tzu-Hsin
author_facet Liu, Tzu-Hsin
Liu, Tsung-Yu
柳宗佑
author Liu, Tsung-Yu
柳宗佑
spellingShingle Liu, Tsung-Yu
柳宗佑
How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
author_sort Liu, Tsung-Yu
title How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
title_short How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
title_full How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
title_fullStr How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
title_full_unstemmed How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.
title_sort how technological innovation influence development of dynamic capability : the case study of asml corporation.
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/43988009690947568404
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